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 Si1013R/X
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V) RDS(on) () 1.2 at VGS = - 4.5 V - 20 1.6 at VGS = - 2.5 V 2.7 at VGS = - 1.8 V ID (mA) - 350 - 300 - 150
FEATURES
* Halogen-free Option Available * High-Side Switching * * * * * Low On-Resistance: 1.2 Low Threshold: 0.8 V (Typ.) Fast Switching Speed: 14 ns 1.8 V Operation TrenchFET(R) Power MOSFETs
RoHS
COMPLIANT
* 2000 V ESD Protection
APPLICATIONS
SC-75A or SC-89
G 1
3
D
S
2
SC-75A (SOT-416): Si1013R - Marking Code D SC-89 (SOT-490): Si1013X - Marking Code B
Top View
* Drivers: Relays, Solenoids, Lamps, Hammers, Displays, Memories * Battery Operated Systems * Power Supply Converter Circuits * Load/Power Switching Cell Phones, Pagers
BENEFITS
* * * * * Ease in Driving Switches Low Offset (Error) Voltage Low-Voltage Operation High-Speed Circuits Low Battery Voltage Operation
Ordering Information: SI1013R-T1-E3 (SC-75A, Lead (Pb)-free) Si1013R-T1-GE3 (SC-75A, Lead (Pb)-free and Halogen-free) Si1013X-T1-E3 (SC-89, Lead (Pb)-free) Si1013X-T1-GE3 (SC-89, Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 C)b Pulsed Drain Currenta Continuous Source Current (diode conduction)b Maximum Power Dissipationb for SC-75 Maximum Power Dissipation for SC-89 Operating Junction and Storage Temperature Range Gate-Source ESD Rating (HBM, Method 3015) Notes: a. Pulse width limited by maximum junction temperature. b. Surface Mounted on FR4 board.
b
Symbol VDS VGS TA = 25 C TA = 85 C ID IDM IS TA = 25 C TA = 85 C TA = 25 C TA = 85 C TJ, Tstg ESD PD
5s 6 - 400 - 300
Steady State - 20 - 350 - 275 - 1000 - 250 150 80 250 140 - 55 to 150 2000
Unit V
mA
- 275 175 90 275 160
mW
C V
Document Number: 71167 S-81444-Rev. C, 23-Jun-08
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Si1013R/X
Vishay Siliconix
SPECIFICATIONS TA = 25 C, unless otherwise noted
Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Qg Qgs Qgd td(on) tr td(off) VDD = - 10 V, RL = 47 ID - 200 mA, VGEN = - 4.5 V, RG = 10 VDS = - 10 V, VGS = - 4.5 V, ID = - 250 mA 1500 150 450 5 9 35 11 ns pC VGS(th) IGSS IDSS ID(on) RDS(on) gfs VSD VDS = VGS, ID = - 250 A VDS = 0 V, VGS = 4.5 V VDS = - 16 V, VGS = 0 V VDS = - 16 V, VGS = 0 V, TJ = 85 C VDS = - 5 V, VGS = - 4.5 V VGS = - 4.5 V, ID = - 350 mA VGS = - 2.5 V, ID = - 300 mA VGS = - 1.8 V, ID = - 150 mA VDS= - 10 V, ID = - 250 mA IS = - 150 mA, VGS = 0 V - 700 0.8 1.2 1.8 0.4 - 0.8 - 1.2 1.2 1.6 2.7 S V - 0.45 1 - 0.3 2 - 100 -5 V A nA A mA Symbol Test Conditions Min. Typ. Max. Unit
tf Fall Time Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
For the following graphs, P-Channel negative polarities for all voltage and current values are represented as positive values.
1.0 VGS = 5 thru 3 V 0.8
I D - Drain Current (mA)
I D - Drain Current (A)
1000
2.5 V
800
TJ = - 55 C 25 C
0.6 2V 0.4 1.8 V
600
125 C
400
0.2
200
0.0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 0.0
0.5
VDS - Drain-to-Source Voltage (V)
1.0 1.5 2.0 2.5 VGS - Gate-to-Source Voltage (V)
3.0
Output Characteristics
Transfer Characteristics
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Document Number: 71167 S-81444-Rev. C, 23-Jun-08
Si1013R/X
Vishay Siliconix
TYPICAL CHARACTERISTICS
4.0
TA = 25 C, unless otherwise noted
120
R DS(on) - On-Resistance ()
3.2
C - Capacitance (pF)
100
VGS = 1.8 V 2.4 VGS = 2.5 V 1.6 VGS = 4.5 V 0.8
80
Ciss
60
40 Coss 20 Crss 0 4 8 12 16 20
0.0 0 200 400 600 800 1000 ID - Drain Current (mA)
0
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
5 VDS = 10 V ID = 250 mA 4 R DS(on) - On-Resistance (Normalized) 1.4 1.6
Capacitance
VGS - Gate-to-Source Voltage (V)
VGS = 4.5 V ID = 350 mA 1.2 VGS = 1.8 V ID = 150 mA
3
2
1.0
1
0.8
0 0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.6 - 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
1000 TJ = 125 C RDS(on) - On-Resistance () 4 I S - Source Current (mA) 5
On-Resistance vs. Junction Temperature
100 TJ = 25 C TJ = - 55 C 10
3 ID = 350 mA 2 ID = 200 mA 1
1 0.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5 6 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Surge-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 71167 S-81444-Rev. C, 23-Jun-08
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Si1013R/X
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
0.3 3.0
0.2 V GS(th) Variance (V) ID = 0.25 mA 0.1 IGSS - (A)
2.5
2.0
0.0
1.5 VGS = 4.5 V 1.0
- 0.1
- 0.2
0.5
- 0.3 - 50
- 25
0
25
50
75
100
125
0.0 - 50
- 25
0
25
50
75
100
125
TJ - Temperature (C)
TJ - Temperature (C)
Threshold Voltage Variance vs. Temperature
7 BVGSS - Gate-to-Source Breakdown Voltage (V) 6 5 4 3 2 1 0 - 50
IGSS vs. Temperature
- 25
0
25
50
75
100
125
TJ - Temperature (C)
BVGSS vs. Temperature
2 1 Duty Cycle = 0.5
Normalized Effective Transient Thermal Impedance
0.2
Notes:
0.1 0.1 0.05 0.02
PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = R thJA = 833 C/W 3. T JM - T A = PDMZthJA(t)
Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (s)
4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient (SC-75A)
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Document Number: 71167 S-81444-Rev. C, 23-Jun-08
Si1013R/X
Vishay Siliconix
TYPICAL CHARACTERISTICS
2 1 Duty Cycle = 0.5 Thermal Impedance
TA = 25 C, unless otherwise noted
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (s) 1 10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?71167.
Document Number: 71167 S-81444-Rev. C, 23-Jun-08
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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